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Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g431c6.pdf ST WLCSP-49, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline (ST)-4.4 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic Small Outline No-Lead http://www.ti.com/lit/ml/mpds176e/mpds176e.pdf Plastic Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN 4-Lead Plastic Small Outline No-Lead http://www.ti.com/lit/ml/mpds176e/mpds176e.pdf Plastic Small Outline (SO) - Wide, 5.3 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf UQFN, 16 Pin (https://www.ti.com/lit/ds/symlink/tlv9064.pdf#page=44), generated with kicad-footprint-generator ipc_noLead_generator.py DFN, 8 Pin (http://www.fujitsu.com/downloads/MICRO/fsa/pdf/products/memory/fram/MB85RS16-DS501-00014-6v0-E.pdf), generated with kicad-footprint-generator Inductor SMD 2512 (6332 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 6-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_6_05-08-1636.pdf TSOT-23-6 MK06A TSOT-6 Hand-soldering TSOT, 8 Pin (http://www.fujitsu.com/ca/en/Images/MB85RS2MT-DS501-00023-1v0-E.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py TQFN, 24 Pin (https://www.invensense.com/wp-content/uploads/2015/02/PS-MPU-9250A-01-v1.1.pdf#page=39), generated with kicad-footprint-generator Molex Panelmate series connector, B11B-ZESK-D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator connector wire 1.5sqmm double-strain-relief Soldered wire connection with double feed through strain relief, for 2 times 0.127 mm² wires, reinforced insulation, conductor diameter 0.48mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-2V 0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.127 mm² wires, reinforced insulation, conductor diameter 0.48mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 1-770874-x, 2 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator Molex SPOX Connector System, 43045-2400 (alternative finishes: 43045-182x), 9 Pins per row (http://suddendocs.samtec.com/prints/lshm-1xx-xx.x-x-dv-a-x-x-tr-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 48 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation CC), generated with kicad-footprint-generator connector wire 0.127sqmm double-strain-relief Soldered wire connection with double feed through strain relief, for 2 times 0.5 mm² wires, reinforced insulation, conductor diameter 1.7mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, old mpn/engineering number: 5569-14A1, example for new part number: A-41791-0005 example for new part number: 09-65-2108, 10 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-4P-1.25DS%2820%29.

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