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G6K-2F-Y relay package http://omronfs.omron.com/en_US/ecb/products/pdf/en-g6k.pdf Omron G6K-2G-Y relay package http://omronfs.omron.com/en_US/ecb/products/pdf/en-g6k.pdf Omron G6K-2F-Y relay package http://omronfs.omron.com/en_US/ecb/products/pdf/en-g6k.pdf Relay Omron G6S-2F, see http://omronfs.omron.com/en_US/ecb/products/pdf/en-g6s.pdf Relay Omron G5V-1, see http://omronfs.omron.com/en_US/ecb/products/pdf/en-g5v_1.pdf Relay SPDT Omron Serie G6E Relay SPDT Potter&Brumfield T9AP5D52 12V 30A 1xEin Connector Fast ON Flachsteckeranschluss Only Dummy for Space NO Pads Relay SPDT Omron Serie G5Q Relay Omron G6SK-2G, see http://omronfs.omron.com/en_US/ecb/products/pdf/en-g6s.pdf Relay Omron G6S-2G, see http://omronfs.omron.com/en_US/ecb/products/pdf/en-g6s.pdf Relay Omron G6SK-2, see http://omronfs.omron.com/en_US/ecb/products/pdf/en-g6s.pdf Fujitsh FTR B3S B3SA Relay J JLeg AXICOM HF3-Series Relay Pitch 1.27mm SSOP, 8 Pin (http://www.macronix.com/Lists/Datasheet/Attachments/7534/MX25R3235F,%20Wide%20Range,%2032Mb,%20v1.6.pdf#page=79), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, 105314-xx14, 7 Pins (https://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=826576&DocType=Customer+Drawing&DocLang=English), generated with kicad-footprint-generator JST XH vertical boss JST XH series connector, 502443-0270 (http://www.molex.com/pdm_docs/sd/5024430270_sd.pdf), generated with kicad-footprint-generator JST SH series connector, B7B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Inductor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator ipc_noLead_generator.py WSON6 3*3 MM, 0.95 PITCH; CASE 506AH-01 (see ON Semiconductor 932BB.PDF 144-Lead Plastic Thin Shrink Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true 6-pin plasic small outline package; 18 leads; body width 4.4 mm; Exposed Pad Variation; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot510-1_po.pdf TSSOP, 44 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/2512S.pdf#page=17), generated with kicad-footprint-generator Hirose DF63 through hole, DF11-30DP-2DSA, 15 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 0.5 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41791-0011 example for new part number: A-41791-0013 example for new part number: A-41792-0002 example for new part number: A-41791-0012 example for new mpn.

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