Labels Milestones
Back1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7.
- Package; 8-Lead Plastic SO, Exposed Die Pad (TI.
- Header, 1x27, 1.27mm pitch, 4.4mm socket.
- -4.702208e-03 9.968302e-01 vertex -1.063085e+02 9.725134e+01 1.152487e+01.