Labels Milestones
BackSmall outline package; 18 leads; body width 16.90 mm Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 10-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads.
- Vertex 2.87011 -6.92909 6.0001 vertex.
- (1050 mils), SMDSocket, LongPads 24-lead though-hole mounted.