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WOG pitch 5.08mm size 15.2x9.8mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00088, 12 pins, dual row (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_7x7_Dual_Row_%5BSVB%5D_C04-21420a.pdf 40-Lead (32-Lead Populated) Plastic Quad Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [SOIC] (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf SOIC, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_TDFN_2x3_MNY_C04-0129E-MNY.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 32-lead plastic TSOP; Type II TSOP-II, 44 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/39935c.pdf#page=152), generated with kicad-footprint-generator ipc_noLead_generator.py DFN 8 2x2mm, 0.5mm http://www.qorvo.com/products/d/da000896 DFN 0.5 ST 20-Lead Plastic Quad Flat No-Lead Package, Body 3.0x3.0x0.8mm, Texas Instruments DSBGA BGA Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7 BGA, 22x22 grid, 19x19mm.

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