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Integrations E Package eSIP-7F Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300.

• ST TFBGA-225, 13.0x13.0mm, 225 Ball, 15x15 Layout, 0.8mm.
• 11.4023 0 0.18985 facet normal.
• Normal 4.720724e-001 -8.093099e-001 3.495213e-001 facet normal -0.124717 -0.987204.
• 0.807217 0.0635208 0.586827 vertex 1.95005 0.326085 19.9.

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