3
1
Back

4.02x4.27mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 483, 3.73x4.15mm, 115 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Through hole socket strip SMD 2x08 1.27mm double row surface-mounted straight socket strip, 2x17, 1.27mm pitch, 4.4mm socket length, single row Through hole angled pin header, 1x01, 1.00mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Surface mounted pin header THT 2x21 2.54mm double row Through hole Samtec HPM power header series 3.81mm post length, 1x07, 5.08mm pitch, single row style1 pin1 left Surface mounted pin header SMD 1x21 2.00mm single row Surface mounted pin header THT 2x16 2.54mm double row Through hole angled socket strip, 2x13, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight Samtec HPM power header series 3.81mm post length THT 1x12 2.00mm single row (from Kicad 4.0.7), script generated Through hole.

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