Labels Milestones
BackPlastic DFN (3mm x 3mm) (see Linear Technology DFN_12_05-08-1725.pdf DE/UE Package; 12-Lead Plastic DFN (5.55mm x 5.2mm), Pin 5-8 connected to EP (http://www.aosmd.com/res/packaging_information/DFN5x6_8L_EP1_P.pdf 56-Lead Plastic Quad Flat, No Lead Package (UC) - 3x3x0.5 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 24-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x16.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 1x-dip-switch SPST , Piano, row spacing 22.86 mm (900 mils), Socket 5-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 18-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 20-lead surface-mounted (SMD) DIP package.
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