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Pack, 1.27mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/A1369-Datasheet.ashx Allegro Microsystems SIP-4, 1.27mm Pitch (https://www.diodes.com/assets/Package-Files/SIP-3-Bulk-Pack.pdf Diodes SIP-3 Bulk Pack Diodes SIP-3 Bulk Pack, 1.27mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/A1363-Datasheet.ashx Diodes SIP-3 Ammo Pack, 2.65mm Pitch (https://www.diodes.com/assets/Package-Files/SIP-3-Ammo-Pack.pdf Diodes SIP-3 Bulk Pack Diodes SIP-3 Bulk Pack Diodes SIP-3 Bulk Pack, 1.27mm Pitch (https://www.diodes.com/assets/Package-Files/SIP-3-Bulk-Pack.pdf Diodes SIP-3 Bulk Pack, 1.27mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/A1369-Datasheet.ashx Allegro Microsystems 24-Lead Plastic QFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf sensor pressure ssop 98ARH99066A sensor pressure ssop 98ARH99089A pressure sensor automotive honeywell Pressure Sensor, Dual-Barbed, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=MS5525DSO&DocType=DS&DocLang=English LEM LV25-P Voltage transducer, https://www.lem.com/sites/default/files/products_datasheets/lv_25-p.pdf LEM Hall Effect Voltage transducer 3M 40-pin zero insertion force socket, through-hole, row spacing 10.16 mm (400 mils 22-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 1x-dip-switch SPST Copal_CHS-01B, Slide, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 1x-dip-switch SPST Copal_CHS-01B, Slide, row spacing 7.62 mm (300 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 4x-dip-switch SPST , Slide, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 6-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 48-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils 10-lead though-hole mounted DIP package, row spacing 7.62.

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