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Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (area) array, NSMD pad definition Appendix A Zynq-7000 BGA, 26x26 grid, 27x27mm package.

• Normal 0.880533 -0.472793 0.0335807 facet normal 1.672296e-15 8.097122e-16.
• (mid 1.143021 2.192818 (end 0.1836.

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