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(https://katalog.we-online.de/em/datasheet/9774015951.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 12, Wuerth electronics 9774070943 (https://katalog.we-online.de/em/datasheet/9774070943.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 44 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/2512S.pdf#page=17), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0410, with PCB locator, 9 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST PUD series connector, S8B-EH (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator connector Hirose DF11 through hole, DF11-6DP-2DSA, 3 Pins per row (http://www.molex.com/pdm_docs/sd/431600105_sd.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 53748-0308, 30 Pins (http://www.molex.com/pdm_docs/sd/529910308_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 4.6, Wuerth electronics 97730256332 (https://katalog.we-online.com/em/datasheet/97730256332.pdf), generated with kicad-footprint-generator Molex Molex 0.30mm Pitch Easy-On Type FFC/FPC Connector, For LVDS, 6.05mm Height, Vertical, Surface Mount, ZIF, Bottom Contact FFC/FPC, 200528-0230, 23 Circuits (https://www.molex.com/pdm_docs/sd/2005280230_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-147-02-xx-DV-TE, 47 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 16 Pin (http://www.ti.com/lit/ds/symlink/ldc1312.pdf#page=59), generated with kicad-footprint-generator ipc_noLead_generator.py DFN8 2x2, 0.5P (https://www.onsemi.com/pub/Collateral/511AT.PDF On Semiconductor, SIP-38, 9x7mm, (https://www.onsemi.com/pub/Collateral/AX-SIP-SFEU-D.PDF#page=19 8-Lead Plastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 18-lead though-hole mounted DIP package, row spacing.

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