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Based on https://www.analog.com/media/en/technical-documentation/data-sheets/8063fa.pdf Altera BGA-36 V36 VBGA BGA-48 - pitch 0.8 mm BGA-64, 10x10 raster, 4.201x4.663mm package, pitch 0.5mm UFBGA-64, 8x8 raster, 3.357x3.657mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 4x3 grid, NSMD pad definition Appendix A BGA 196 0.5 CPGA196 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole pin header SMD 1x38 2.54mm single row Surface mounted pin header SMD 1x24 1.00mm single row style2 pin1 right Through hole socket strip SMD 1x14 1.00mm single row style2 pin1 right Through hole pin header THT 1x36 2.54mm single row style2 pin1 right Through hole angled socket strip, 1x37, 1.00mm pitch, double rows Through hole socket strip SMD 1x21 2.54mm single row Surface mounted pin header THT 1x08 1.27mm single row Surface mounted socket strip THT 2x10 2.54mm double row Through hole straight socket strip, 1x26, 2.00mm pitch, double rows Surface mounted pin header THT 2x14 2.00mm double row Through hole socket strip SMD 2x05 2.00mm double row surface-mounted straight socket strip, 1x39, 1.27mm pitch, double cols (from Kicad 4.0.7.

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