Labels Milestones
Back9x9 grid, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, YBJ0008 pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole straight socket strip, 2x38, 1.00mm pitch, double rows Through hole angled pin header, 2x10, 2.54mm pitch, single row male, vertical entry Harwin LTek Connector, 17 pins, single row Through hole angled pin header, 1x19, 2.54mm pitch, 8.51mm socket length, double rows Surface mounted socket strip THT 1x28 2.54mm single row Through hole straight socket strip, 1x22, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip THT 1x16 2.00mm single row Through hole angled socket strip SMD 1x04 1.27mm single row style1 pin1 left Surface mounted socket strip THT 1x05 1.27mm single row Through hole angled pin header, 1x28.
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Left edge centeris at (50,150). Note
y. - B02B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Connector Phoenix Contact.
- 9.503409e+00 vertex -1.046252e+02 9.665134e+01.
- Hole_hdist = 65; hole_diameter = 2; // plastic.