Labels Milestones
BackSIPAK, Horizontal, RM 2.54mm, staggered type-2, see http://www.ti.com/lit/ds/symlink/lm3886.pdf TO-220F-11 Vertical RM 1.7mm IIPAK I2PAK TO-262-5, Horizontal, RM 5.08mm, see http://www.vishay.com/docs/88769/woo5g.pdf diode bridge Three phase, Bridge, Rectifier 4-lead round diode bridge Thermal enhanced ultra thin SMD package; 3 leads; body: 4.3x6.1x0.43mm, https://www.vishay.com/docs/95570/to-277asmpc.pdf 3-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_5_05-08-1635.pdf TSOT, 6 Pin (https://docs.broadcom.com/docs/AV02-4755EN), generated with kicad-footprint-generator Molex CLIK-Mate series connector, BM12B-ZESS-TBT (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Soldered wire connection, for 3 times outer diameter, generated with kicad-footprint-generator JST AUH side entry JST NV series connector, 505405-1570 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0310, with PCB trace.
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