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BackTSSOP HTSSOP 0.65 thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 506CE.PDF DD Package; 8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf DFN package size 32.2x9.1x15mm^3, https://www.recom-power.com/pdf/Innoline/R-5xxxPA_DA.pdf RPA60-FW 60W Isolated DC to DC Converters dc-dc recom buck sip-12 pitch 2.54mm DCDC-Converter, RECOM, RECOM_R-78S-0.1, SIP-4, pitch 2.54mm, size 25.86x6.5mm^2, drill diamater 1.15mm.
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X="3.8" y="2.4"/>
4.045691e+000 8.059354e-001 2.475471e+001 facet normal 4.792337e-001. - File Images/IMG_6777.JPG false L1.