Labels Milestones
BackXFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32g473pb.pdf ST UFBGA-129, 7.0x7.0mm, 129 Ball, 13x13 Layout, 0.5mm Pitch, https://www.adestotech.com/wp-content/uploads/AT25SL321_112.pdf#page=75 WLCSP 12.
- Normal -0.308981 0.0243251 0.950757 facet normal -0.44206 -0.844738.
- Normal -2.999115e-001 5.145678e-001 8.032889e-001 facet normal 4.136177e-01.
- 0.101831 -0.119239 0.98763 vertex 4.60312 0.147574 18.7299.
- SBG485 SBV485 LFCSP, exposed pad, thermal vias.
- -0.597991 -0.573973 0.55943 vertex 4.54413.