3
1
Back

Mm Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size 9.78x25.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 3x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads 10-lead though-hole mounted DIP package, row spacing 7.62.

New Pull Request