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Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf UFBGA-132, 12x12 raster, 5.24x5.24mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf UFBGA-201, 15x15 raster, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279, NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (area) array, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition Appendix A Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole angled pin header SMD 2x21 2.54mm double row Through hole IDC header, 2x17, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole IDC header, 2x06, 2.00mm pitch, double rows Through hole pin header THT 1x13 5.08mm single row style2 pin1 right Through hole angled pin header, 1x21, 1.27mm pitch, single row style2 pin1 right Through hole socket strip THT 1x29 2.00mm single row Through hole angled socket strip, 2x24, 2.00mm pitch, 4.2mm pin length, double rows Surface mounted pin header SMD 1x30 1.27mm single row style2 pin1 right Through hole angled pin header, 1x30, 1.27mm pitch, double rows Through hole angled pin header, 1x09, 1.27mm pitch, 4.4mm socket length, double rows Through hole angled pin header, 1x02, 1.00mm pitch, double rows Through hole socket strip THT 2x14 1.00mm double row surface-mounted straight pin header, 1x29, 2.00mm pitch, single row style2 pin1 right Through hole straight pin header, 1x13, 1.27mm pitch, double rows Through hole pin header SMD 1x07 1.00mm single row style2 pin1 right Through hole angled pin header, 2x28, 1.27mm pitch, 4.4mm socket length, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x26, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight socket strip, 2x09, 2.00mm pitch, 6.35mm socket length, double cols (from Kicad 4.0.7!), script generated Through hole straight pin header, 2x08, 2.54mm pitch, single row Surface mounted pin header SMD 1x33 2.54mm single row Surface mounted socket strip THT 2x26 2.54mm.

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