synth_tools

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2x38 2.00mm double row Through hole straight pin header, 1x19, 1.00mm pitch, 2.0mm pin length, double rows Surface mounted socket strip SMD 1x38 2.00mm single row (from Kicad 4.0.7), script generated Through hole pin header SMD 1x04 1.27mm single row Surface mounted socket strip SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, open SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, open SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open SMD Solder Jumper, 1x1.5mm rounded Pads, 0.3mm gap, open SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, pads 1-2 Bridged2Bar with 2 pads, pad diameter 2.1mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.5 mm² wire, basic insulation, conductor diameter 0.9mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-2V 0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py 72-Lead Frame Chip Scale Package - 4x4x0.9 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flatpack (MW) - 10x10x1.0 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [QFN] with thermal vias; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-169, 13x13 raster, 7x7mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UCBGA-49, 7x7 raster, 3.417x3.151mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf WLCSP-64, 8x8 raster, 5x5mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-169, 13x13 raster, 7x7mm package, pitch 0.8mm; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32f042k6.pdf WLCSP-36, 6x6 raster, 2.605x2.703mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script.

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