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Outline (SO) - Wide, 5.3 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf TQFP, 48 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0144.PDF), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 1 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter.

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