Labels Milestones
BackBody 5x5x0.8mm, Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_8_6.pdf LFCSP 8pin thermal pad HTSSOP32: plastic thin shrink small outline package; 10 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot510-1_po.pdf TSSOP.
- 0.272847 0.961333 facet normal -0.977563 0.185897 0.0990623 facet.
- -8.44206 17.8205 facet normal.
- 250VAC/VDC, 350VAC/VDC, 10.5 x 4.5 x 4.5mm.