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1x14, 1.00mm pitch, single row style1 pin1 left Surface mounted pin header SMD 1x18 1.27mm single row style2 pin1 right Through hole socket strip SMD 1x27 2.00mm single row style2 pin1 right Through hole angled socket strip THT 1x13 2.54mm single row Through hole socket strip THT 1x13 5.08mm single row (from Kicad 4.0.7), script generated Through hole angled pin header, 2x11, 1.00mm pitch, double rows Surface mounted pin header THT 1x39 1.27mm single row (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x37 2.54mm single row Surface mounted socket strip THT 1x10 2.00mm single row Through hole straight socket strip, 2x13, 2.00mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole angled socket strip SMD 2x13 1.27mm double row Through hole angled pin header, 2x31, 2.54mm pitch, single row (from Kicad 4.0.7), script generated Through hole pin header THT 1x12 2.00mm single row male, vertical entry, PN:G125-FVX1605L0X Harwin Gecko Connector, 16 pins, pitch 5mm, size 35x10mm^2, drill diamater 1.3mm, pad diameter 2.1mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00045_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block WAGO 804-307 45Degree pitch 5mm size 15x12.5mm^2 drill 1.4mm pad 2.8mm terminal block Metz Connect Type171_RT13702HBWC pitch 7.5mm size 30x9mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00088, vertical (cable from top), 3 pins, pitch 2.5mm, size 18x5mm^2, drill diamater 1.3mm, pad diameter 2.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py 20-Lead Frame Chip Scale Package - 10x10x0.9 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead Plastic DFN (5mm x 3mm) (see Linear Technology 05081707_A_DHD16.pdf DH Package; 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad; (http://www.ti.com/lit/ds/symlink/drv8833.pdf HTSSOP, 16 Pin (http://www.st.com/resource/en/datasheet/lis331hh.pdf), generated with kicad-footprint-generator Molex Pico-EZmate_Slim side entry JST PUD series connector, SM12B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator Molex LSHM 0.50 mm Razor Beam High-Speed Hermaphroditic Terminal/Socket Strip, LSHM-110-xx.x-x-DV-S, 10 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST ZE series connector, B6B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 4.5mm, height 2, Wuerth electronics 97730506334 (https://katalog.we-online.com/em/datasheet/97730506334.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502426-4410, 44 Pins per row (http://www.molex.com/pdm_docs/sd/431602102_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-109-02-xxx-DV-A, 9 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.25mm, height 2, Wuerth electronics 9774060243 (https://katalog.we-online.de/em/datasheet/9774060243.pdf), generated with kicad-footprint-generator JST PH series connector, 501331-1207 (http://www.molex.com/pdm_docs/sd/5013310207_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 0.127 mm² wires, reinforced insulation, conductor diameter 1.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-2V 0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer.

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