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BackAssembly. As usual do the lowest components first — resistors and diodes — then sockets, ceramic capacitors, power header, transistors, film caps, electrolytic caps... Something like that. Latest commits for file Schematics/SynthMages.pretty/Switch.lib Latest commits for branch v1.1 Finish PCBs Checkpoint after converting most things to SMD Binary files a/Panels/Futura XBlk BT.ttf From 51a08380a94a002bd27260320b805b082bdb3963 Mon Sep 17 00:00:00 2001 eb8580ef62 Undo converting GND to GND_JMP and fix everything that broke From 969311f00cbb6d6ece9a25b5fb1d4e2884e468c0 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Fix for component clearance, panel thickness from printer realities bugfix/10hp More layout updates Delete 'Panels/futura medium condensed bt.ttf Normal file View File Panels/title_test_22.stl Normal file View File 3D Printing/Cases/Eurorack Modular Skeleton/Eurorack_box_v105.stl Executable file View File true L1 2 keahS oidaR footprint "6.3mm_NPTH_MAXJLCPCB" (version 20221018) (generator pcbnew footprint "PinSocket_1x03_P2.54mm_Vertical" (version 20211014) (generator pcbnew main arrasta/arrasta_playbook_v0.9.txt 106 lines REP: repique CAX: caixa MSD: mid surdo (sometimes MS1, MS2, etc, if multiple measures or has planned variations) BSD: back surdo // 1 rotary switch - this needs a TLC7524/AD7524 (a simple DAC that's still.
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