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LED, http://www.kingbrightusa.com/images/catalog/SPEC/CA56-12SRWA.pdf 4 digit 7 segment blue LED with left dot Overflow +- 1 orange LED One digit 7 segment green, https://docs.broadcom.com/docs/AV02-2553EN -1 overflow 7 segment yellow, https://docs.broadcom.com/docs/AV02-2553EN One digit 7 segement super bright orange 7 segment green LED display Dubble digit green 7 segment orange LED with left dot One digit 7 segment green LED, http://www.kingbright.com/attachments/file/psearch/000/00/00/CA56-12SEKWA(Ver.7A).pdf 4 digit 7 segment LCD 3 1/5 digit reflective arrow bat + 7 + 8); // pot + led + switch? Col_right = width_mm - thickness*2.2; footprint "SLIDE_POT_0547" (version 20211014) (generator pcbnew footprint "PinSocket_1x03_P2.54mm_Vertical" (version 20211014) (generator pcbnew f1ff8406b4 Delete '3D Printing/Panels/image.png' 6523065365 Go to file 2cbdb94ba9 updated C5 footprint & tracing; schematic annotation 2cbdb94ba94f485ce4abcb1f14e2e5f15d016647 updates the potentiometer pads and thermal vias; see section 7.7 of http://www.st.com/resource/en/datasheet/DM00330506.pdf WLCSP-100, 10x10 raster, 9x9mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/DM00366448.pdf WLCSP-168, 12x14 raster, 4.891x5.692mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zd.pdf WLCSP-64, 8x8 raster, 3.623x3.651mm package, pitch 0.8mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l052t8.pdf WLCSP-36, 6x6 raster, 2.605x2.703mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf WLCSP-64, 8x8 raster, 5x5mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=292, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=88, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, YBG pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32g473pb.pdf ST UFBGA-129, 7.0x7.0mm, 129 Ball, 13x13 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row Through hole straight socket strip, 1x28, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole horizontal IDC box.

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