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2.54mm 26.669999999999998mm 1050mil SMDSocket LongPads 24-lead though-hole mounted DIP package, row spacing 25.4 mm (1000.

• 1.414349e+000 -4.059309e+000 2.494118e+001 facet normal -0.0983909 -0.0148301.
• 9x9mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf.

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