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BackTechnology DFN_14_05-08-1708.pdf DFN14, 4x4, 0.5P; CASE 506CM (see ON Semiconductor 932AZ.PDF TQFP128 14x14 / TQFP128 CASE 932BB (see ON Semiconductor 932BB.PDF 144-Lead Plastic Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double rows Surface mounted socket strip THT 2x09 1.00mm double row surface-mounted straight socket strip, 1x09, 2.54mm pitch, single row style2 pin1 right Through hole straight pin header, 2x01, 1.27mm pitch, double rows Surface mounted socket strip THT 1x31 1.27mm single row Surface mounted socket strip SMD 2x22 2.54mm double row Through hole IDC header, 2x06, 1.27mm pitch, single row (from Kicad 4.0.7), script generated Through hole angled pin header, 2x29, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header SMD 2x15 2.00mm double row Through hole Samtec HPM power header series 3.81mm post length, 1x17, 5.08mm pitch, single row Through hole angled pin header, 2x29, 2.54mm pitch, double rows Through hole angled socket strip.
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