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Schematics/SynthMages.pretty/C_Rect_L22.0mm_W6.1mm_P20mm_MKT_BIG_RED_CAP.kicad_mod create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/Molex_KK-254_AE-6410-02A_1x02_P2.54mm_Vertical.kicad_mod delete mode 100644 Schematics/Unseen Servant/fp-info-cache glide in (sleeve and normal both GND Glide attenuator (B10k) (join two left pins from below - Clock POT is too small for a single 0.25 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 1mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Tantalum Capacitor SMD Kemet-U (6032-15 Metric), IPC_7351 nominal, (Body size source: http://www.vishay.com/docs/20056/crcw01005e3.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 4.5mm, height 6, Wuerth electronics 9774050982 (https://katalog.we-online.de/em/datasheet/9774050982.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 22-27-2041, 4 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 6 times 0.127 mm² wires, reinforced insulation, conductor diameter 0.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-105-02-xxx-DV-BE, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF63R-5P-3.96DSA, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py HVQFN, 24 Pin (http://pdfserv.maxim-ic.com/package_dwgs/21-0139.PDF), generated with kicad-footprint-generator Molex CLIK-Mate series connector, LY20-32P-DLT1, 16 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ103130.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 46007-1103, 3 Pins (https://www.molex.com/pdm_docs/sd/009652028_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 3.1, Wuerth electronics 97730406330 (https://katalog.we-online.com/em/datasheet/97730406330.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 28 Pin (JEDEC MO-153 Var CB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with StandardBox.py) (https://product.tdk.com/info/en/document/catalog/smd/inductor_commercial_power_slf6045_en.pdf Inductor, TDK, SLF12565, 12.5mmx12.5mm (Script generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, 42819-22XX, With thermal vias and counter-pad, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON-10 package 2x3mm body, pitch 0.5mm, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON-10 package 2x3mm body, pitch 0.5mm UFBGA-64, 8x8 raster, 5x5mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=25 FBGA-78, 10.5x9.0mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf BGA 289 0.8 ZAV.

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