Labels Milestones
BackOrd, fn4, hg y0=-0.1; y1=0; y2=abs(hsh); y3=hg-abs(hsh); y4=hg; y5=hg+0.1; if ( hsh >= 0 module knurled_finish(ord, ird, lf, sh, fn, rn [ ord*cos(lf2), ord*sin(lf2), h0], [ ird*cos(lf0), ird*sin(lf0), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ 0,0,h2], [ ord*cos(lf0), ord*sin(lf0), h0], [ ord*cos(lf2), ord*sin(lf2), h0], [ ord*cos(lf2), ord*sin(lf2), h0], [ ird*cos(lf1), ird*sin(lf1), h2], [ ird*cos(lf1), ird*sin(lf1), h0], [ ord*cos(lf2), ord*sin(lf2), h0], [ ord*cos(lf2), ord*sin(lf2), h0], [ ird*cos(lf0), ird*sin(lf0), h1], [ ord*cos(lf0), ord*sin(lf0), h0], [ ird*cos(lf0), ird*sin(lf0), h1], [ ord*cos(lf1), ord*sin(lf1), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ ord*cos(lf0), ord*sin(lf0), h0], [ ord*cos(lf2), ord*sin(lf2), h0], [ ird*cos(lf0), ird*sin(lf0), h1], [ ord*cos(lf1), ord*sin(lf1), h1], [ ord*cos(lf1), ord*sin(lf1), h1], [ 0,0,h2], Created on Tue Mar 5 20:19:51 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984" (1 hole Total plated holes unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots T2.
- 170.12 117.025 (end 169.1 124.9625 (end 154.17 123.75.
- Normal -4.015069e-001 -7.030049e-001 5.870062e-001.
- 110 (end 168.6 113.6875 (end 161.6 72.75.
- 43160-0104, With thermal vias in pads, 5.