synth_tools

Back

Chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments (http://www.ti.com/lit/ds/symlink/tps22993.pdf QFN, 24 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation EB), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 16 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=266), generated with kicad-footprint-generator Mounting Hardware, inside through hole 4.5mm, height 3, Wuerth electronics 97730456332 (https://katalog.we-online.com/em/datasheet/97730456332.pdf), generated with kicad-footprint-generator Molex Picoflex Ribbon-Cable Connectors, 90814-0010, 10 Pins per row (http://www.molex.com/pdm_docs/sd/431605304_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LGA, 14 Pin (https://www.ti.com/lit/ml/msop002a/msop002a.pdf), generated with kicad-footprint-generator TE, 826576-3, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOP, 8 Pin (http://www.st.com/resource/en/datasheet/pm8834.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: AE-6410-07A example for new mpn: 39-28-924x, 12 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 53748-0208, 20 Pins (https://www.molex.com/pdm_docs/sd/537480308_sd.pdf), generated with kicad-footprint-generator JST PUD series connector, DF52-8S-0.8H (https://www.hirose.com/product/en/products/DF52/DF52-3S-0.8H%2821%29/), generated with kicad-footprint-generator Molex SPOX Connector System, 43045-0421 (alternative finishes: 43045-100x), 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST SUR series connector, S5P-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator JST PHD series connector, S6B-XH-A-1 (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Soldered wire connection, for 2 times 0.75 mm² wires, reinforced insulation, conductor diameter 1.4mm, length 8.5mm, width 2.8mm, e.g. Ettinger 13.13.890, https://katalog.ettinger.de/#p=434 Through hole straight pin header, 2x24, 1.00mm pitch, 2.0mm pin length, double cols (from Kicad 4.0.7), script generated Surface mounted pin header SMD 1x40 2.54mm single row Through hole angled pin header THT 2x22 1.00mm double row surface-mounted straight pin header, 2x18, 1.27mm pitch, 4.0mm pin length, single row style1 pin1 left Surface mounted socket strip SMD 1x28 1.27mm single row Surface mounted socket strip THT 1x23 2.54mm single row Through hole pin header THT 1x04 2.00mm single row Through hole angled pin header, 2x31, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole angled pin header THT 1x38 1.00mm single row Through hole Samtec HPM power header series 11.94mm post length, 1x13, 5.08mm pitch, single row Through hole straight socket strip, 2x33, 1.27mm pitch, double rows Through hole vertical IDC box header THT 1x10.

New Pull Request

Labels Milestones