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Back"Name": "Top Silk Screen" "Name": "Top Solder Mask" "Name": "Bottom Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Solder Paste" "Name": "Top Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Solder Mask" "Name": "Bottom Solder Mask" "Name": "Bottom Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Silk Screen" Hardware/Panel/precadsr-panel/precadsr-panel-cache.lib Normal file Unescape Hardware/Panel/precadsr_panel_al_Gerbers/precadsr_panel_al-F_Cu.gbr Normal file Unescape threeUHeight = 133.35; // overall 3u height panelOuterHeight =128.5; panelInnerHeight = 110; //rail clearance = ~11.675mm, top and bottom railHeight = (threeUHeight-panelOuterHeight)/2; mountSurfaceHeight = (panelOuterHeight-panelInnerHeight-railHeight*2)/2; hp=5.08; hwCubeWidth = holeWidth-mountHoleDiameter; offsetToMountHoleCenterY=mountSurfaceHeight/2; offsetToMountHoleCenterX=hp;//1hp margin on each copy of Copyright © 2015, Joe Tsai and The Pennsylvania State University Licensed under the Apache License, Version 2.0 (the "License"); MIT License (MIT) Copyright (c) 2020 Matthew Holt Permission is hereby granted, free of charge, to any person obtaining a copy The MIT License Copyright (c) 2015 Titus Wormer Permission is hereby granted, free of charge, to any person obtaining a copy Copyright (c) 2018.
- Do Envelope/Envelope.kicad_pcb Normal file Unescape.
- Cylindrical part of this License prior to 60.
- Holes: unplated through holes: .