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BackBody [DFN] (see Microchip Packaging Specification 00000049BS.pdf DFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/20005474E.pdf#page=25), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41791-0005 example for new mpn: 39-30-0060, 3 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-4P-1.25DS%2820%29/), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip Type FFC/FPC, 502250-2391, 23 Circuits (http://www.molex.com/pdm_docs/sd/5022502391_sd.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Straight solder pin 1.
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