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Back[QFN]; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf WLCSP-36, 6x6 raster, 2.5x2.5mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f031k6.pdf WLCSP-25, 5x5 raster, 2.097x2.493mm package, pitch 0.35mm; https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, YBG pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.5mm Pitch, https://ww1.microchip.com/downloads/en/DeviceDoc/16B_WLCSP_CS_C04-06036c.pdf WLCSP-20, 4x5 raster, 1.934x2.434mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/DM00366448.pdf WLCSP-168, 12x14 raster, 4.891x5.692mm package, pitch 0.4mm; see section 36.2.3 of http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-42363-SAM-D11_Datasheet.pdf WLCSP-56, 7x8 raster, 3.170x3.444mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f411vc.pdf WLCSP-49, 7x7 raster, 2.965x2.965mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition Appendix A Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole Samtec HPM power header series 11.94mm post length, 1x05, 5.08mm pitch, single row Through hole angled pin header, 2x24, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled socket strip, 2x01, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header SMD 1x37 2.00mm single row Surface mounted socket strip THT 1x35 2.54mm single row Through hole angled pin header THT 1x25 1.27mm single row Through hole angled pin header, 1x13, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x22 1.27mm single row Through hole straight pin header, 1x06, 1.00mm pitch, 2.0mm pin length, single row Surface mounted socket strip THT 1x23 1.27mm single row style2 pin1 right Through hole angled pin header THT 1x12 2.54mm single row style2 pin1 right Through hole pin header THT 1x34 1.00mm single row Through hole straight pin header, 2x20, 1.00mm pitch, 2.0mm pin length, single row style1 pin1 left Surface mounted pin header THT 2x15 1.00mm double row surface-mounted straight pin header, 1x24, 1.27mm pitch, single row style2 pin1 right Through hole IDC header, 2x07, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x01, 2.54mm pitch, single row Through hole angled socket strip THT 2x38 2.54mm double row Through hole pin header SMD 1x13 2.00mm single row style1 pin1 left Surface mounted socket strip SMD 1x08 2.00mm single row Through hole straight socket strip, 2x36, 1.27mm pitch, double rows Through hole straight socket strip, 2x23, 1.27mm pitch, 4.0mm pin.
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- (6 holes) T4 10.000mm 0.3937" (4 holes) T5.