Labels Milestones
BackDSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline (SM) - 5.28 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf VQFN, 16 Pin package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, Analog Devices KS-4 (like EIAJ SC-82 Infineon PG-HDSOP-10-1 (DDPAK), 20.96x6.5x2.3mm, slug up (https://www.infineon.com/cms/en/product/packages/PG-HDSOP/PG-HDSOP-10-1/ HSOF-8-1 [TOLL] power MOSFET (http://www.infineon.com/cms/en/product/packages/PG-HSOF/PG-HSOF-8-3/ Infineon PG-TO-220-7, Tab as Pin 8, see e.g. Https://www.infineon.com/dgdl/Infineon-BTS50055-1TMC-DS-v01_00-EN.pdf?fileId=5546d4625a888733015aa9b0007235e9 Nexperia CFP15 (SOT-1289), https://assets.nexperia.com/documents/outline-drawing/SOT1289.pdf On Semiconductor ECH8, https://www.onsemi.com/pub/Collateral/318BF.PDF Low Profile 8x8mm PQFN, Dual Cool 88, https://www.onsemi.com/pub/Collateral/FDMT80080DC-D.pdf TO-50-4 Power Macro Package Style M234 Rohm HRP7 SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-3-1/ D2PAK DDPAK TO-263 D2PAK-9 TO-263-9 TO-268/D3PAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-7-1/ D2PAK DDPAK TO-263 D2PAK-9 TO-263-9 TO-268/D3PAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO252/PG-TO252-3-1/ TO-252/DPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-7-1/ D2PAK DDPAK TO-263 D2PAK-5 TO-263-5 SOT-426 TO-263 / D2PAK / DDPAK SMD package, http://rohmfs.rohm.com/en/techdata_basic/ic/package/hrp7_1-e.pdf, http://rohmfs.rohm.com/en/products/databook/datasheet/ic/motor/dc/bd621x-e.pdf SC-59, hand-soldering varaint, https://lib.chipdip.ru/images/import_diod/original/SOT-23_SC-59.jpg SOT, 3 Pin (https://www.jedec.org/system/files/docs/to-236h.pdf variant AB), generated with kicad-footprint-generator ipc_noLead_generator.py DFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/20005045C.pdf#page=23), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 80 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator ipc_noLead_generator.py MLPQ 32 leads, 7x7mm, 0.127mm stencil (https://www.infineon.com/dgdl/ir4302.pdf?fileId=5546d462533600a4015355d602a9181d, https://www.infineon.com/dgdl/Infineon-AN1170-AN-v05_00-EN.pdf?fileId=5546d462533600a40153559ac3e51134 14-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 10-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 9x-dip-switch SPST CTS_Series194-9MSTN, Piano, row spacing 7.62 mm (300 mils), Socket 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x30.12mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 8x-dip-switch SPST CTS_Series194-8MSTN, Piano, row spacing 7.62 mm (300 mils), body size 9.78x7.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 7x-dip-switch SPST KingTek_DSHP07TJ, Slide, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 10x-dip-switch SPST , Slide, row spacing.
- Https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F2834006%7FB6%7Fpdf%7FEnglish%7FENG_CD_2834006_B6.pdf%7F2834006-1 TE Connectivity Buchanan.
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