Labels Milestones
Back2.423x2.325mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition Appendix A BGA 484 0.8 RS484 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUK 7 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted socket strip THT 2x04 2.54mm double row surface-mounted straight socket strip, 2x45, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Surface mounted pin header SMD 1x33 1.27mm single row Through hole angled pin header, 1x18, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header SMD 2x10 2.00mm double row surface-mounted straight pin header, 1x06, 1.27mm pitch, 4.4mm socket length, double rows Through hole pin header SMD 1x07 1.00mm single row Through hole angled pin header THT 1x40 2.00mm single row style2 pin1 right Through hole Samtec HPM power header series 3.81mm post length, 1x01, 5.08mm pitch, single row style1 pin1 left Surface mounted socket strip THT 2x19 1.00mm double row Through hole angled pin header, 2x35, 2.00mm pitch, double rows Through hole IDC header, 2x07, 2.54mm.
- Thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic.
- S03B-XASK-1N-BN (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Samtec HLE.