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Technology DFN_16_05-08-1732.pdf DHC Package; 18-Lead Plastic DFN (3mm x 3mm) (see Linear Technology 1956f.pdf TSSOP, 16 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=266), generated with kicad-footprint-generator Molex CLIK-Mate series connector, BM07B-GHS-TBT (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator JST VH vertical JST PHD series connector, B5B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator connector Molex Micro-Fit_3.0 horizontal connector Molex Nano-Fit Power Connectors, old mpn/engineering number: 1-770969-x, 3 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 100-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm Footprint [TQFP] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 28 leads; body width 6.1 mm; lead pitch 0.635; (see NXP sot054_po.pdf to-92 sc-43 sc-43a.

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