Labels Milestones
BackSurface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size 10.8x26.96mm 10x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf Power Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 9.78x32.66mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 6x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), body size 6.7x11.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 5x-dip-switch SPST , Piano, row spacing 5.9 mm (232 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 8x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), missing pin 7 removed (Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flat, No Lead Package (MD) - 4x4x0.9 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 SSO, 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), Socket, LongPads 22-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 14-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 14-lead though-hole.
- No latches, PN:G125-MVX2005L0X Harwin.
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- 5mm, size 60x7.6mm^2, drill diamater 1.3mm, pad diameter.