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Back4.3mm, M4 mounting screws (https://www.vishay.com/docs/95423/sot227g2.pdf, https://www.vishay.com/docs/95793/vs-fc420sa10.pdf TR TO-3 TO3 TO-204 TO-3P-3, Horizontal, RM 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf TO-220-3 Vertical RM 5.08mm TO-126-2, Vertical, RM 0.97mm, Multiwatt-9, staggered type-2 TO-220-7, Vertical, RM 10.9mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-4 Vertical RM 2.54mm TO-220-4 Vertical RM 1.27mm MultiwattF-15 staggered type-2 TO-220-4, Horizontal, RM 2.54mm, IIPAK, I2PAK, see http://www.onsemi.com/pub/Collateral/EN8586-D.PDF TO-262-3 Vertical RM 2.54mm TO-247-5, Vertical, RM 5.45mm, , see https://toshiba.semicon-storage.com/ap-en/design-support/package/detail.TO-3P(N).html TO-3P-3 Vertical RM 4.58mm IPAK TO-251-2, Vertical, RM 5.08mm, see http://cdn-reichelt.de/documents/datenblatt/A400/W005M-W10M_SEP.PDF diode bridge DFS, see http://www.vishay.com/docs/88854/padlayouts.pdf TO-269AA MBS diode bridge Thermal enhanced ultra thin SMD package; 3 leads; body: 4.3x6.1x0.43mm, https://www.vishay.com/docs/95570/to-277asmpc.pdf 3-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_8_05-08-1637.pdf Texas Instrument DRT-3 1x0.8mm Pitch 0.7mm Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, NSMD pad definition Appendix A BGA 225 0.8.
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