3
1
Back

Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline http://www.vishay.com/docs/49633/sg2098.pdf SOP, 16 Pin (https://www.nxp.com/docs/en/package-information/SOT109-1.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 64 Pin (JEDEC MO-153 Var CA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Molex Pico-Clasp series connector, 14110813001xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13001XXX_100228421DRW046C.pdf), generated with kicad-footprint-generator JST VH PBT series connector, B2P-VH-B (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator ipc_qfp_generator.py 64-Lead Plastic Quad Flat, No Lead Package - 3x3 mm Body [DFN] (see Microchip.

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