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Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf ST WLCSP-132, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 484 0.8 SB484.

• Panels/dual_vca.scad | 393 create mode 100644.
• "Modules Index" cannot be undone.
• Vertex 5.77925 4.28385 7.9151 facet normal 0.124559 0.036638.

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