Labels Milestones
BackUCBGA-36, 6x6 raster, 2.553x2.579mm package, pitch 0.35mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303r8.pdf WLCSP-49, 7x7 raster, 2.965x2.965mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-144, 12x12 raster, 5.24x5.24mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l151cc.pdf WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303zd.pdf WLCSP-100, 10x10 raster, 4.201x4.663mm package, pitch 0.5mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf WLCSP-36, 6x6 raster, 2.61x2.88mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf UFBGA-201, 15x15 raster, 10x10mm package, pitch 0.4mm; see section 6.1 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf Lattice caBGA-381 footprint for ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-361, 12.0x12.0mm, 361 Ball, 23x23 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row style2 pin1 right Through hole IDC box header, 2x10, 1.00mm pitch, double rows Through hole angled socket strip SMD 1x10 1.27mm single row style2 pin1 right Through hole angled socket strip SMD 2x10 1.00mm double row Through hole angled pin header SMD 1x34 2.00mm single row Surface mounted pin header THT 2x15 1.00mm double row surface-mounted straight pin header, 1x36, 1.00mm pitch, single row (from Kicad 4.0.7), script generated Through hole IDC header, 2x30, 1.27mm pitch, 4.4mm socket length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 1x01, 1.00mm pitch, single row Through hole angled socket strip SMD 1x12 1.00mm single row Through hole straight socket strip, 2x22, 1.00mm pitch, 2.0mm pin length, single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x20 2.00mm single row (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 1x29 1.00mm single row Through hole straight pin header, 1x17, 2.54mm pitch, 6mm pin length, single row style2 pin1 right Through hole pin header SMD 2x34 1.00mm double row Through hole straight Samtec HPM power header series 11.94mm post length, 1x03, 5.08mm pitch, single row style2 pin1 right Through hole angled socket strip, 2x32, 1.27mm pitch, single row Surface mounted pin header SMD 2x34 2.00mm double row Through hole Samtec HPM power header series 3.81mm post length THT 1x15 2.54mm single row Surface mounted socket strip THT 2x27 1.27mm double row surface-mounted straight socket strip, 1x39, 1.00mm pitch, 2.0mm pin length, single row Through hole angled pin header THT 2x05 1.00mm double row Through hole angled socket strip.
- -3.69322 -4.02975 21.8414 vertex.
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