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BackProcedure for assembly. As usual do the lowest components first — resistors and diodes — then sockets, ceramic capacitors, power header, transistors, film caps, electrolytic caps... Something like that. Latest commits for branch pcb_finalization re-re-remove the mysterious extra trace main Add scad for v3.2 f33ea6a168329cd0061e01c376cbd377f46ddc60 @circuitlocution.com created pull request 'pcb_finalization' (#1) from bugfix/10hp into main Merge pull request synth_mages/MK_VCO#1 32ded0979b Fix rail clearance = ~11.675mm, top and bottom railHeight = (threeUHeight-panelOuterHeight)/2; mountSurfaceHeight = (panelOuterHeight-panelInnerHeight-railHeight*2)/2; panelInnerOffset = (panelOuterHeight-panelInnerHeight)/2; echo("railHeight: ", railHeight); offsetToMountHoleCenterX = hp - holeOffset; // 1 for manual glide (rv16 // Everything OUT goes on the same form factor, with maybe a little bit of margin footprint_depth = .25; //non-printing, barely-visible outline of component footprints printer_z_fix = 0.2; // this one is easy hole_bottom.
- Vertex -5.274917e+000 1.974161e+000 1.747200e+001 facet normal 0.741154.
- -0.0815518 -0.0820835 0.993283 vertex -5.59201 4.18951 7.89187.
- 236-208 45Degree pitch 5mm size.
- 10.16, SMD, 18K/W, TO-263, D2 Pak, https://www.shopaavid.com/Product/573300D00000G Heatsink.