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LQFP, 208 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator ipc_noLead_generator.py DDB Package; 12-Lead Plastic DFN (3mm x 2mm) 0.40mm pitch DDB Package; 8-Lead Plastic SO, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Shrink.

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