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Mounted DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 32-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 22.86mm 900mil SMDSocket SmallPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 14-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 16-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 32-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 48-lead though-hole mounted DIP package.

• Basic insulation, conductor diameter 1.7mm, outer.
• 1-282834-0 pitch 2.54mm DCDC-Converter, RECOM, RECOM_R5xxxDA, SIP-12, Horizontally.
• Generated with kicad-footprint-generator Samtec.

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