3
1
Back

4-lead surface-mounted (SMD) DIP package, row spacing 22.86 mm (900 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET LA MOSFET Infineon DirectFET MB MOSFET Infineon DirectFET LA MOSFET Infineon DirectFET S2 MOSFET Infineon DirectFET MP MOSFET Infineon DirectFET SQ MOSFET Infineon DirectFET MD MOSFET Infineon DirectFET MQ MOSFET Infineon DirectFET MD MOSFET Infineon DirectFET L6 MOSFET Infineon DirectFET S2 MOSFET Infineon DirectFET ST MOSFET.

New Pull Request