Labels Milestones
BackSpacing 10.16 mm (400 mils), Socket 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 18-lead though-hole mounted high-volatge DIP package (based on standard DIP-4), row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 DIL DIP PDIP 2.54mm 24.13mm 950mil SMDSocket LongPads 42-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 22-lead surface-mounted (SMD) DIP package, row spacing 6.73 mm (264 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD.
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