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Back\#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole) Total plated holes count 16 ============================================================= Total unplated holes count 16 Not plated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1.
- 0.288318 0.956944 0.0336339 facet normal 0.758285 -0.622326.
- For Vishay CNY70 refective photo coupler package.
- 5209c5fd76f5cb84bb09be3d7c836a3c6a5d5355 Upload files to '3D Printing/Panels/AD&D 1e.
- 0.545222 -0.816125 -0.1915 facet normal.