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RF676 RFG676 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUS 5 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), Socket, LongPads 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 5, row spacing 15.24 mm (600 mils), Socket, LongPads 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x24.42mm 9x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 9x-dip-switch SPST , Piano, row spacing 5.08 mm (200 mils), body size 6.7x21.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 10x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size 9.78x12.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 11x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x30.12mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 7x-dip-switch SPST CTS_Series194-7MSTN, Piano, row spacing 5.08mm, pin-spacing 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 2.54 4-lead dip package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, 4x4mm body, pitch 0.5mm UFBGA-64, 8x8 raster, 4.466x4.395mm package, pitch 0.5mm; see section 10.3 of https://www.parallax.com/sites/default/files/downloads/P8X32A-Propeller-Datasheet-v1.4.0_0.pdf 44-Lead Plastic Thin Shrink Small Outline No-Lead 8-Lead Plastic VSON, 3x3mm Body, 0.5mm Pitch, S-PWSON-N10, DSC, http://www.ti.com/lit/ds/symlink/tps63060.pdf USON-10 2.5x1.0mm_ Pitch 0.5mm USON-20 2x4mm Pitch 0.4mm http://www.chip.tomsk.ru/chip/chipdoc.nsf/Package/C67E729A4D6C883A4725793E004C8739!OpenDocument WSON-16 3.3 x 1.35mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=42, https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf BGA 5 0.5 YZP Texas Instruments, RWH0032A, 8x8x0.9mm (http://www.ti.com/lit/ds/snosd10c/snosd10c.pdf DFN, 10 Pin (https://www.ti.com/lit/ds/symlink/bq24090.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for a 1uF capacitor. 1uF may be unnecessary, though. - C10, C14 is a ceramic 104 power cap like C5, C6, C8, C9, C11, C12. C10, C14 too small for a recipient of ordinary skill to be larger than the.

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