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(https://ww2.minicircuits.com/case_style/GP731.pdf) following land pattern PL-079, including GND vias (https://ww2.minicircuits.com/pcb/98-pl230.pdf Footprint for Mini-Circuits case QQQ130 (https://ww2.minicircuits.com/case_style/QQQ130.pdf Footprint for Mini-Circuits case GP731 (https://ww2.minicircuits.com/case_style/GP731.pdf) following land pattern PL-035, including GND-vias (https://ww2.minicircuits.com/pcb/98-pl035.pdf Footprint for the Covered Software, or under the terms of this module I might panel mount the 3PDT switch. * The 16 mm vertical board mount OR: | | | C10 | 3 | 10k | Resistor | | | | | | | | C3, C4, C10 | 1 uF | Polarized capacitor | | J12 | 1 | Conn_01x02 | SIP socket, 2.54 mm, 1x10 Pin socket, 2.54 mm, 1x2 (see build notes) 1 SIP socket, 2.54 mm, 1x10 | | | | U3 | 1 | B10k | **Potentiometer, 9 mm vertical board mount OR: | | | | U1 | 1 | SW_3PDT_x3 | Switch, single pole double throw, illuminated paddle, red and green LEDs K switch single-pole double-throw spdt ON-ON D Push button switch, generic, two pins Switch, single pole double throw, right angle, stacked (https://www.molex.com/content/dam/molex/molex-dot-com/products/automated/en-us/salesdrawingpdf/484/48406/484060001_sd.pdf USB 3.0 type A Plug, Horizontal, http://cnctech.us/pdfs/1001-011-01101.pdf USB-A receptacle horizontal through-hole GCT USB1046, USB Type C, right-angle, SMT, https://datasheet.lcsc.com/lcsc/2206091745_XKB-Connectivity-U254-051T-4BH83-F1S_C397452.pdf USB Micro-B receptacle, horizontal, SMD, 10118193, with flange, https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10118193.pdf Dustproof Micro USB Type B 10103594-0001LF, http://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10103594.pdf USB USB_B USB_micro USB_OTG USB Micro-B, right-angle, SMT, https://datasheet.lcsc.com/lcsc/2204071530_G-Switch-GT-USB-7010ASV_C2988369.pdf USB Type C Plug Shenzhen Jing Tuo Jin Electronics Co 918-118A2021Y40002 ( https://datasheet.lcsc.com/lcsc/1912111437_Jing-Extension-of-the-Electronic-Co--918-118A2021Y40002_C399939.pdf ) also compatible with SOIC-8, 3.9x4.9mm body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, 4x4mm body, pitch 0.5mm, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON-10 package 2x3mm body, pitch 0.5mm, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON-10 package 2x3mm body, pitch 0.5mm, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON-10 package 2x3mm body, pitch 0.5mm UFBGA-64, 8x8 raster, 4.539x4.911mm package, pitch 0.4mm; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32l011k3.pdf WLCSP-36, 6x6 raster, 2.61x2.88mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l476me.pdf WLCSP-81, 9x9 raster, 4.4084x3.7594mm package, pitch 0.5mm UFBGA-64, 8x8 raster, 3.347x3.585mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00213872.pdf WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf LFBGA-144, 12x12 raster, 7x7mm package, pitch 0.5mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l031f6.pdf WLCSP-25, 5x5 raster, 2.097x2.493mm package, pitch.

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