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D="M 0,457.02 H 166 V 0.02 H 0 40 Y N 1 F N DEF Kosmo_panel_Led_Hole H 0 40 Y N 1 F N DEF Graphic GRAF 0 40 Y Y 5 N DEF SW_SPDT_MSM SW 0 1 0 PCM_kikit NPTH 0 0 0 Y N 1 F N DEF SW_Push_DPDT SW 0 0 Y N 1 F N DEF SW_DIP_x12 SW 0 40 Y N 1 F N DEF SW_DIP_x06 SW 0 40 N N 1 F N DEF SW_DIP_x08 SW 0 40 Y N 1 F N DEF SW_DIP_x08 SW 0 0 Y N 1 F N DEF SW_SPST_Temperature SW 0 40 N N 1 F N DEF LM3900N U 0 5 Y Y 1 F N DEF SW_SPDT_MSM SW 0 0 Y N 1 F N DEF Kosmo_panel_Led_Hole H 0 40 N N 1 F N DEF SW_Push_45deg SW 0 0 Y N 1 F N DEF SW_SPDT_MSM SW 0 40 Y N 1 F N DEF Synth_power_2x5_passive J 0 40 Y Y 1 F N DEF SW_SPDT SW 0 20 Y N 1 F N DEF SW_DPST SW 0 0 Y N 1 F N DEF SW_E3_SA3216 SW 0 40 N N 1 F N DEF SW_Coded_SH-7040 SW 0 0 Dual VCA, based roughly on Moritz Klein's schematic, with features added from Skull and Circuit's VCA v1.3. 3D Printing/Panels/AD&D 1e spell names in Filmoscope Quentin/Panels/FIREBALL VCO.png' d8deca9307af08e321f2f6168a97d7f0d7734956 Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin/PRISMATIC SPHERE.png From 943ef1409b7317dabcc4b76bf70a2fada90d2c4f Mon Sep 17 00:00:00 2001 Subject: [PATCH] Notes from debugging main MK_SEQ/Schematics/Unseen Servant/Unseen Servant_slider_board_noncanonical.kicad_dru Normal file View File 3D Printing/Cases/Eurorack Modular Case/image004k.jpg Executable file View File Find and replace last few thin traces, fix teardrops and gnd fill Embiggen traces, add teardrops updated C5 footprint & tracing; schematic annotation 6523065365 updates the potentiometer pads and thermal vias; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f207vg.pdf WLCSP-66, 8x9 raster, 3.767x4.229mm package, pitch 0.8mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf ST WLCSP-132, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, pitch 0.4mm; see section 6.8 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf WLCSP-144, 12x12 raster, 7x7mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303zd.pdf WLCSP-100, 10x10 raster, 10x10mm package, pitch 0.4mm; see section 6.8 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-265, 17x17 raster, 14x14mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f100v8.pdf TFBGA-100, 10x10 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A BGA 676 1.

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