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TO-220-15, Vertical, RM 5.08mm, see http://cdn-reichelt.de/documents/datenblatt/A400/W005M-W10M_SEP.PDF diode bridge Vishay KBL rectifier package, 5.08mm pitch, single row (from Kicad 4.0.7), script generated Through hole socket strip SMD 2x39 2.00mm double row Through hole Samtec HPM power header series 11.94mm post length THT 1x03 1.27mm single row style1 pin1 left Surface mounted socket strip SMD 2x18 2.54mm double row Through hole angled pin header, 2x07, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole angled pin header SMD 1x03 1.27mm single row (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x28, 2.00mm pitch, double rows Through hole horizontal IDC header THT 1x22 2.54mm single row style1 pin1 left Surface mounted socket strip SMD 1x08 2.00mm single row style2 pin1 right Through hole angled pin header, 1x12, 2.00mm pitch, 6.35mm socket length, double rows Through hole straight socket strip, 2x10, 1.00mm pitch, 2.0mm pin length, double rows Through hole angled pin header, 2x19, 2.00mm pitch, double rows Through hole angled pin header THT 1x30 2.54mm single row male, vertical entry, PN:G125-FVX2605L0X Harwin Gecko Connector, 20 pins, surface mount PLCC, 52 pins, through hole 2.25mm, height 1, Wuerth electronics 9775096360 (https://katalog.we-online.com/em/datasheet/9775096360.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-102-02-xxx-DV-BE-LC, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TQFP120 14x14 / TQFP120 CASE 932AZ (see ON Semiconductor 506AH.PDF DFN, 6 Pin (http://www.onsemi.com/pub/Collateral/NCP133-D.PDF), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-114-02-xxx-DV, 14 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 1.5 mm² wire, reinforced insulation, conductor diameter 0.9mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex CLIK-Mate series connector, BM12B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TQFP120 14x14 / TQFP120 CASE 932AZ (see ON Semiconductor 506CE.PDF DD Package; 12-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_16_05-08-1706.pdf DHD Package; 16-Lead Plastic Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 6x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads THT DIP DIL ZIF 25.4mm 1000mil Socket 3M 16-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils 12-lead surface-mounted (SMD) DIP package, row spacing 6.73 mm (264 mils), body size 6.7x24.42mm.

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